Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder/Co-P Plating and Ni-Co-P Plating
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منابع مشابه
Investigation of interfacial reactions between Sn–Zn solder with electrolytic Ni and electroless Ni(P) metallization
In this study, interfacial reactions of electrolytic Ni and electroless Ni(P) metallization of the ball-grid-array (BGA) substrate with the molten n–9Zn (wt.%) eutectic solder alloy were investigated, focusing on the shear strengths and the identification of the intermetallic compound IMC) phases at various reflow periods. Zn-containing Pb-free solder alloys were kept in molten condition (240 ◦...
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ژورنال
عنوان ژورنال: QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY
سال: 2011
ISSN: 0288-4771
DOI: 10.2207/qjjws.29.142s